PEK-CN/SiC复合材料的制备及热学性能

Preparation and Thermal Properties of PEK-CN/SiC Composites

以酚酞聚芳醚腈酮(PEK-CN)为基体、碳化硅(SiC)为导热填料,用硅烷偶联剂(KH550,KH560及KH570)对SiC进行表面改性,通过静电纺丝技术和高温模压法制备了PEK-CN/SiC复合材料,研究了SiC含量和不同偶联剂改性SiC对PEK-CN/SiC薄膜的微观形貌、PEK-CN/SiC复合材料的导热性能和热稳定性的影响。结果表明:偶联剂改性SiC后以及随着SiC含量的增加,PEK-CN/SiC复合材料的导热性能与热稳定性均有所改善。当经KH560表面改性的SiC质量分数为25%时,复合材料的导热系数最大,达到了0.586 W/(m·K),比PEK-CN导热系数提高了133.5%,玻璃化转变温度、失重5%及30%时的温度较PEK-CN分别提升了3.79,0.37,225.76℃。

Using phenolphthalein poly(aryl ether nitrile ketone)(PEK-CN) as matrix, silicon carbide(SiC) as thermal conductivity filler and the surface of SiC was modified with silane coupling agent(KH550, KH560 and KH570). PEK-CN/SiC composites were prepared by electrospinning and high temperature molding. The effects of SiC content and SiC modified by different coupling agent on the microstructure of PEK-CN/SiC films, the thermal conductivity and thermal stability of PEK-CN/SiC composites were studied. The results show that after SiC is modified by coupling agent and with the increase of SiC content, the thermal conductivity and thermal stability of PEK-CN/SiC composites are improved. When the mass fraction of SiC modified by KH560 is 25%, the thermal conductivity of the composites is the highest 0.586 W/(m·K), which is 133.5% higher than that of PEK-CN, and the glass transition temperature, the temperature at 5% and 30% weight loss are 3.79, 0.37,225.76 ℃ higher than those of PEK-CN, respectively.