临时键合技术在晶圆级封装领域的研究进展

Research Progress of Temporary Bonding Technology in Wafer Level Packaging

随着5G、人工智能和物联网等新基建的逐步完善,单纯依靠缩小工艺尺寸来提升芯片功能和性能的方法已经难以适应未来集成电路产业发展的需求。为满足集成电路的多功能化及产品的多元化,通过晶圆级封装技术克服摩尔定律物理扩展的局限性日趋重要。目前,在晶圆级封装正朝着大尺寸、三维堆叠和轻薄化方向发展的背景下,临时键合与解键合(TBDB)工艺应运而生。针对晶圆级封装领域可商用的TBDB技术,论述了不同TBDB工艺在晶圆级封装领域的研究进展及应用现状,明晰了不同TBDB技术所面临的挑战和机遇,提出了相应的解决方案,并展望了未来的研究方向。

With the gradual improvement of new infrastructures such as 5G,artificial intelligence and the internet of things,it is no longer possible to rely solely on process size reduction to improve the function and performance of chips to meet the future development needs of the integrated circuit(IC)industry.In order to meet the multi-function and product diversification of IC,it is increasingly important to overcome the limitations of the physical extension of Moore's Law through wafer level packaging technology.Temporary bonding and debonding(TBDB)processes have emerged as wafer-level packaging is moving towards to the direction of larger sizes,three-dimensional stacks and thinning.Aiming at the commercially available TBDB technology in wafer level packaging,the current research progress and application status of different TBDB processes in wafer level are discussed,the challenges and opportunities faced by different TBDB technologies are clarified,corresponding solutions are proposed,and future research direction is envisaged.