镍磷合金超精密磨削过程的分子动力学仿真

Molecular Dynamics Simulation of Ultra-Precision Grinding of Nickel-Phosphorus Alloys

运用分子动力学对单颗二氧化硅磨粒磨削镍磷合金过程进行模拟,研究不同磨削速度和压力下的磨削过程、磨削过程中正压力对磨削深度的影响以及磨削过程中势能的变化规律,并对其波动原因进行分析。仿真结果表明,在镍磷合金磨削过程中,随着磨粒的运动,二氧化硅磨粒对镍磷合金表面产生挤压作用,导致合金表面层发生剪切变形,使得部分原子堆积在磨粒前方并储存应变能。当应变能超过合金原子键断裂所需的能量时,合金原子之间的金属键发生断裂,形成对合金表面层的去除。随着应变能储存及金属键断裂的往复进行,磨削力及势能处于往复波动状态。

The grinding process of nickel-phosphorus alloy by single silica abrasive was simulated by molecular dynamics.The grinding process under different grinding speed and grinding pressure, the influence of positive pressure on grinding depth and the variation rule of potential energy in grinding process were studied, and the reason of its fluctuation was analyzed. The simulation results show that in the process of nickel phosphorus alloy grinding, grinding grain movement, silica particle surface of nickel phosphorus alloy extrusion effect, cause a shear deformation of the alloy surface layer, part of the atomic pile up in front of the abrasive, and strain energy storage, when strain energy than the energy for the metal atoms bond rupture, alloy metallic bond between atoms break, the removal of the surface layer of the alloy is formed. The grinding force and potential energy are in a state of reciprocating fluctuation with the storage of strain energy and the fracture of metal bonds.