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亚微米活化Mo-15Cu合金晶间反应机制 被引量:1

Intergranular Reaction Mechanism of Submicron-Activated Mo-15Cu Alloy
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摘要 为了研究具有亚微米组分的钼铜粉末烧结时的晶间反应机制,采用亚微米活化层法制备了一种具备晶间反应层的钼铜复合材料。采用X射线衍射仪(XRD)、扫描电镜(SEM)、能谱仪(EDS)、透射电镜(TEM)、高分辨透射电镜(HRTEM),对Mo-15Cu合金组织形貌、连接和结构特征进行了表征。研究了亚微米活化层对钼铜复合材料晶间反应的影响。结果表明,添加8%(质量分数)亚微米粉,可形成厚度约0.5μm纳米活化层。Mo亚微米颗粒通过流动、扩散,改变晶间反应机制,形成了真正意义上的晶间反应层,厚度约为5 nm,实现了冶金结合。 In order to investigate the intergranular reaction mechanism during sintering of molybdenum-copper powders with submicron components, a Mo-15Cu composite with an intergranular reaction layer was prepared by a submicron-activated layer method. The histomorphology, connectivity and structural characteristics of Mo-15Cu alloy were characterized by X-ray diffractometer(XRD), scanning electron microscope(SEM), energy dispersive spectrometer(EDS), transmission electron microscope(TEM), and high-resolution transmission electron microscope(HRTEM). The effect of submicron-activated layers on the intergranular reaction of Mo-15Cu composites was investigated. The results show that the submicron-activated layer with a thickness of 0.5 μm is formed by adding 8wt% submicron powder. The submicron-sized Mo particles change the intergranular reaction mechanism through flow and diffusion, forming an intergranular reaction layer with a thickness of about 5 nm and achieving metallurgical bonding.
作者 王敬泽 尹佳庆 崔建文 常晶 于彦东 孙云龙 Wang Jingze;Yin Jiaqing;Cui Jianwen;Chang Jing;Yu Yandong;Sun Yunlong(School of Materials Science and Chemical Engineering,Harbin University of Science and Technology,Harbin 150040,China;College of Intelligent Systems Science and Engineering,Harbin Engineering University,Harbin 150006,China)
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2023年第2期448-453,共6页 Rare Metal Materials and Engineering
基金 Project supported by the Reform and Development of Local Colleges and Universities of the Central Government of China(323210001) Project supported by the Harbin Talents of China(2015RAQXJ036)。
关键词 钼铜伪合金 纳米孪晶 晶间反应层 亚微米活化层 冶金结合 Mo-Cu pseudo-alloys nano-twin intergranular reaction layer submicron-activated layer metallurgical bonding
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