用于集成电路制造中良率监控的国产化电子束缺陷检测设备

Localized electron beam inspection equipment for yield monitoring in integrated circuits manufacture

电子束缺陷检测设备是集成电路制造中不可或缺的良率监控设备。其基本原理是结合扫描电镜成像技术、高精度运动控制技术、高速图像数据处理和自动检测分类算法等,在集成电路制造环节对晶圆及集成电路的物理缺陷和电性缺陷进行检测。为填补此类设备国产化空白,通过自主研发,突破了高分辨力大视场扫描成像、三维高精度定位补偿、智能化缺陷检测和分类等技术难点,研发了国产化电子束缺陷检测设备并应用于集成电路产线,填补了国内空白,为推动我国集成电路领域检测技术的发展起到了重要作用。

Electron beam inspection equipment plays an important role in the yield monitoring of integrated circuits(IC) manufacture. Combining technologies of scanning electron microscopy, high-precision motion control, high-speed image processing and automatic defect classification, this equipment can inspect physical and electrical defects on IC wafers in IC manufacturing processes. In order to fill in the blank of localization, our team has independently developed the equipment. Key technical breakthroughs in highresolution large field scanning imaging, 3D high-precision positioning with compensation, AI-assisted defect capture and classification have been made. The localized electron beam inspection equipment have already been developed and used in IC manufacture. This will accelerate the development of IC inspection technology in China.