嵌入微流道的四通道瓦片式TR组件设计

Design of Four-channel Tile-type T/R Module Embedded with Microchannel

瓦片式TR组件因其集成度高、体积小,在集成度要求较高且功率要求不高的系统中得到广泛应用。随着以GaN为代表的第三代半导体的广泛使用,TR组件的发射功率日益提高,传统的散热方式已不能满足未来系统使用需求。如何实现高效散热成为瓦片式TR组件大功率应用的研究重点。微流道冷却技术作为一种新型的散热方式,大大提高了换热性能。在四通道瓦片式TR组件设计中将具有高效散热的微流道集成在盒体中,实现了瓦片式TR组件300 W/cm^(2)以上的局部高散热能力。

The tile-type T/R module has been widely used in the system with high integration and low power requirement because of its high integration and small size.With the widespread use of the third generation semiconductor represented by GaN,the transmission power of T/R module is increasing day by day,and the traditional heat dissipation methods can no longer meet the needs of the future system.How to achieve effi cient heat dissipation has become the research focus of high-power application of the tile-type T/R module.As a new way of heat dissipation,micro-channel cooling technology greatly improves the heat transfer performance.In the design of four-channel tile-type T/R module,the micro-channel with efficient heat dissipation is integrated into the box,and the local efficient heat dissipation capacity of more than 300 W/cm^(2 )is realized.