摘要
In IEEE International Solid-State Circuits Conference(ISSCC)2023,CMOS process is still the dominating fabrication technology for image sensors,and three-dimensional(3D)wafer-stacked process with Cu–Cu pixel-level connection has been adopted to achieve small pixel size and high integration level.The development of CMOS image sensors(CIS)is still focusing on the trends of high performance and more functionalities,such as hybrid event-based vision sensor(EVS)and terahertz(THz)/X-ray image sensor.
基金
the National Natural Science Foundation of China(62134004)
the National Key Research and Development Program of China(2022YFB2804402)
Basic Frontier Scientific Research Program of the Chinese Academy of Sciences(ZDBS-LY-JSC008)。
