碳化硅封装用耐温环氧树脂的性能研究及应用

Study on properties and application of temperature-resistant epoxy resin for silicon carbide packaging

碳化硅因其优异的物理特性,逐渐成为功率半导体技术的研究热点,但是其功率器件的封装存在高结温、高导热以及高温下不够稳定的问题。普通封装胶的耐温性能和导热性能低、热膨胀系数高,无法满足碳化硅器件的封装。如何提高封装胶的耐温和导热性能、降低其热膨胀系数是研究重点。采用耐温环氧树脂和氨苯砜固化剂、以球形和片状氧化铝为导热填料制备的封装胶,固化后表现出较低的热膨胀系数、较高的热导率和T g值,此研究可为碳化硅器件封装材料提供一种思路。

Due to its excellent physical properties,silicon carbide has gradually become a research hotspot in power semiconductor technology.However,the packaging of its power devices is problematic on account of high junction temperature,high thermal conductivity and stability at high temperatures.The low temperature resistance,thermal conductivity and high thermal expansion coefficient of ordinary packaging adhesives cannot meet the requirements for packaging of silicon carbide devices.How to improve the temperature resistance and thermal conductivity of encapsulation adhesive and reduce its thermal expansion coefficient is the focus of research.The encapsulation adhesive prepared with temperature resistant epoxy resin and temperature resistant dapsone curing agent and spherical and flaky aluminum oxide as thermal conductive filler shows low thermal expansion coefficient,high thermal conductivity and Tg after curing,which provides an insight into silicon carbide device packaging materials.