硫代酰胺螯合树脂的吸附特性与电镀废水银回收

Adsorption Characteristics of Thioamide Chelating Resin and Its Silver Recovery from Electroplating Wastewater

电镀废水银吸附回收受共存离子及有机物影响。基于胺基聚苯乙烯(APS)制备了一种胺基和芳环协同的硫代酰胺螯合树脂ATMCR,在银吸附特性研究的基础上,将其应用于电镀废水银回收。采用FT-IR、SEM和BET对合成树脂进行了表征。ATMCR对Ag(I)的吸附属于自发、吸热过程,符合拟二级动力学模型,吸附pH为1~2,318 K时ATMCR的吸附容量达177.6 mg/g。高、低两种浓度电镀废水的处理实践表明,在Cu、Ni和COD共存时,ATMCR的Ag回收率>98%,具备较好的工业应用前景。

The adsorption and recovery of silver from electroplating wastewater are affected by coexisting ions and organic materials.A thioamide chelating resin ATMCR based on amine polystyrene(APS)was prepared.Based on its silver adsorption characteristics,ATMCR was applied in the recovery of silver from electroplating wastewater.The synthesized resin was characterized using FT-IR,SEM and BET.The adsorption of Ag(I)by ATMCR was a spontaneous and endothermic process,and conformed to the pseudo-second-order kinetic model.Its adsorption capacity reached 177.6 mg/g at 318 K,and the optimal pH range was between 1 and 2.ATMCR was applied to treat electroplating wastewater with high and low concentration.Its recovery rates of Ag were higher than 98%under the coexistence of Cu,Ni and COD.This material has shown a good industrial application prospect.