高分辨率熔融金属电流体喷印直写工艺

High-Resolution Direct Writing Process of Molten Metal Electrohydrodynamic Jet Printing

固态金属材料以其高导电性和低成本等特点在柔性电子器件的制造中具有巨大的应用潜力,但现有熔融金属微制造工艺的制造精度有限。为了提高熔融金属在导电结构制备中的分辨率,研发了一种熔融金属电流体喷印直写打印方法。对该方法的基本原理进行阐述。利用自主研发的熔融金属电流体喷印喷头装置,以金属锡为原料进行实验,对打印工艺参数进行了研究。探究了脉冲峰值电压、喷嘴高度、打印速度对锡线成型质量的影响规律,研究结果表明:当脉冲峰值电压4.0 kV,喷嘴高度0.20 mm,打印速度2.0 mm/s时,锡线成型质量最好,能实现线宽约为50μm的锡线制备。最后,结合优化的工艺参数在聚酰亚胺(PI)薄膜上制作了高分辨率导电图案,验证了该方法的可行性,为熔融金属材料在柔性电子器件制造中的应用提供了新途径。

Due to their high electrical conductivity and low cost,solid metal materials have great application potential in the fabrication of flexible electronic devices,but the fabrication precision of existing molten metal microfabrication process is limited.To improve the resolution of molten metal in the fabrication of conductive structures,a direct writing method of molten metal electrohydrodynamic jet printing was developed.The basic principle of the method was explained.By using the self-developed molten metal electrospray printing nozzle device,the experiment was carried out with metal tin as the raw material,and the printing process parameters were studied.The influences of peak pulse voltage,nozzle height and printing speed on the quality of solder wire forming were explored.The research results show that when the pulse peak voltage is 4.0 kV,the nozzle height is 0.20 mm,and the printing speed is 2.0 mm/s,the quality of the solder wire is the best.The wire width of about 50μm was prepared.Finally,with the optimized process parameters,high-resolution conductive patterns were fabricated on polyimide(PI)films,verifying the feasibility of the method and providing a new way for the application of molten metal materials in the fabrication of flexible electronic devices.