摘要
共晶焊接是一种低熔点的合金焊接,它是指在相对较低的温度下共晶焊料发生共晶物熔合的现象,共晶合金直接从固态变成液态,而不经过塑性阶段。目前,行业内多采用手动方式实现单芯片共晶,但是在对应微波功率产品的小型化封装时很难满足高度集成化需求,采用多芯片共晶工艺能够满足微波功率产品数量多、体积小、集成度高、可靠性高的优点。
Common crystal welding is a kind of low melting point of alloy welding,it refers to the phenomenon of the cocrystal welding material fusion at a relatively low temperature,the cocrystal alloy directly from the solid state to the liquid,without going through the plastic stage.At present,the industry mostly adopts the manual method to realize the single-chip co-crystal,but it is difficult to meet the needs of high integration in the miniaturization and packaging of the corresponding microwave power products.Multi-chip co-crystal process can meet the advantages of large number,small volume,high integration and high reliability of microwave power products.
作者
蒲晓龙
PU Xiaolong(Sichuan Jiuzhou Electric Appliance Group Co.,Ltd.,Mianyang 621000,China)
关键词
多芯片组件
真空共晶
空洞率
multi-chip components
vacuum cocrystal
cavity rate