多芯片真空共晶工艺研究

Research on multi-chip vacuum co-crystal process

共晶焊接是一种低熔点的合金焊接,它是指在相对较低的温度下共晶焊料发生共晶物熔合的现象,共晶合金直接从固态变成液态,而不经过塑性阶段。目前,行业内多采用手动方式实现单芯片共晶,但是在对应微波功率产品的小型化封装时很难满足高度集成化需求,采用多芯片共晶工艺能够满足微波功率产品数量多、体积小、集成度高、可靠性高的优点。

Common crystal welding is a kind of low melting point of alloy welding,it refers to the phenomenon of the cocrystal welding material fusion at a relatively low temperature,the cocrystal alloy directly from the solid state to the liquid,without going through the plastic stage.At present,the industry mostly adopts the manual method to realize the single-chip co-crystal,but it is difficult to meet the needs of high integration in the miniaturization and packaging of the corresponding microwave power products.Multi-chip co-crystal process can meet the advantages of large number,small volume,high integration and high reliability of microwave power products.