红外-太赫兹光电探测器应用及前沿变革趋势

Application and frontier trend of infrared-terahertz photoelectric detector

自红外辐射被发现以来,科学家一直在努力将红外技术应用于地球观测、航天遥感和宇宙探索等领域。目前,第二、三代红外探测器已进入大规模应用,高端三代也在逐步突破,并随着材料制备技术、纳米加工技术、集成技术和相关交叉学科的发展,开始出现了具有前瞻性的新材料、新技术和新概念。红外-太赫兹探测器也开始由单一探测、被动探测和探测分立的传统探测器形式,逐渐走向多维探测、自主探测和智能化芯片集成的变革发展方向。在介绍光电探测器物理机制的基础上,概述了红外-太赫兹探测技术在天文遥感领域的应用与发展,重点综述了红外-太赫兹探测器有望出现变革式发展的三大方向,包括基于人工微结构的光场集成、基于三维堆叠技术的片上智能化和新型低维材料的应用,并展望了未来探测器向着超高性能、多维感知、智能化和感存算一体化的发展趋势。

Since the discovery of infrared radiation,scientists have been trying to apply infrared technology to the fields of earth observation,space remote sensing and space exploration.At present,the second and third generation of infrared detectors have entered large-scale applications,and the third generation of high-end infrared detectors is gradually breaking through.With the development of material preparation technology,nano-processing technology,integration technology and related cross-disciplines,forwardlooking new materials,new technologies and new concepts have begun to appear.Infrared-terahertz detectors has also begun to change gradually from the traditional form of single detection,passive detection and separate detection to the direction of multi-dimensional detection,autonomous detection and intelligent chip integration.On the basis of introducing the physical mechanism of photoelectric detector,this paper summarizes the application and development of infrared-terahertz detection technology in the field of astronomical remote sensing,then focuses on the three expected revolutionary development direction of infrared-terahertz detectors,including the integration of light field based on artificial microstructure,the on-chip intelligence based on three-dimensional stacking technology and the application of new lowdimensional materials,and finally looks forward to the future development trend of detectors towards ultra-high performance,multi-dimensional sensing,intelligence and integration of sensing,memory and computing.