铜系电子导电浆料用超细铜粉的研制

Preparation of u ltra-fine c opper p owders for c opper-b ased e lectrical c onductive p aste

本文主要采用液相化学还原法制备不同形貌、粒径大小的超细铜粉,采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、激光粒度分析仪进行表征,研究不同种类还原剂对超细铜粉形貌尺寸、粒度分布及粒径大小、振实密度的影响。结果表明,采用葡萄糖-抗坏血酸分步还原法制得平均粒径约1.30um超细铜粉,中高振实密度、分散性好、球形度佳、无明显团聚,粒径大小均一且呈现窄粒径分布特点。

This paper proposes liquid phase chemical reduction method to produce and prepare ultrafine copper powder with different morphologies and particle sizes,which is characterized by scanning electron microscopy(SEM),X-ray diffraction(XRD)and laser particle size analyzer.The effects of different kinds of reducing agents on the morphologies,particle distribution,particle size and tap density of ultrafine copper powders are studied.The results show that the ultrafine copper powder with an average particle size of about 1.30um could be obtained by the glucose ascorbic acid step reduction method.It has the following features:medium and high compaction density,good dispersity,good sphericity,no obvious agglomeration,uniform particle size and narrow particle size distribution.