IC封装设备远距离芯片传输装置设计

Design of Long-Distance Chip Transmission Device for IC Packaging Equipment

芯片传输装置是IC封装设备的一个关键部件,其工艺操作性能直接影响IC封装的生产效率和成品率。为了匹配当前芯片远距离传输工艺的新要求,对远距离芯片传输工艺进行了分析,提出了一种双旋转盘交替式直线轨道芯片传输方案。构建了传输装置结构模型,并进行了芯片传输实施方式描述。

Chip transport device is a key component of IC packaging equipment.Its process performance directly affects the production efficiency and yield of IC packaging.In order to match the new requirements of the current chip transmission technology,the chip transmission technology for long distance is analyzed,a dual rotary table alternating linear track chip transmission scheme is proposed.The transmission device structure model is constructed,and the chip transmission implementation mode is described.