脉冲电沉积制备Cu/Ni多层膜及其力学性能

Effect of Pulse Electrodeposition on Mechanical Properties of Cu/Ni Multilayer Films

研究脉冲电沉积制备Cu/Ni多层膜的结构和力学特性与其制备方法、条件的关系。基于单槽法和双槽法,利用脉冲电沉积技术,通过不同沉积电位、沉积浓度和沉积温度等条件对Cu/Ni多层膜性能的影响进行探索和优化;使用X射线光电子能谱仪、扫描电子显微镜和X射线衍射仪等表征方法分析Cu/Ni多层膜的单层膜铜镍原子比、表面形貌、截面形貌和晶相组成;用附着力性能测试和纳米压痕仪考察了两种Cu/Ni多层膜的附着力性能和力学性能。结果表明,膜层致密平整,结构清晰,硬度和弹性模量均随压入深度先增大后下降,最终硬度稳定在6.5 GPa,弹性模量稳定在100~125 GPa之间,说明脉冲电沉积技术可以实现具有良好附着力性能和力学性能的Cu/Ni多层膜的可控制备。

In order to study the structure and mechanical properties of Cu/Ni multilayer films deposited by pulse electrodeposition technology and their relationship with preparation conditions,Cu/Ni multilayer films are deposited by pulse electrodeposition single-bath and dual-bath,respectively.The effects of different deposition potentials,deposition concentrations and deposition temperatures on the properties of Cu/Ni multilayer films are explored and optimized.The surface and crosssectional morphology of the Cu/Ni multilayer films are analyzed by SEM,and the phase composition of the Cu/Ni multilayer films is analyzed by XRD.The adhesion property and mechanical properties of the two Cu/Ni multilayer films are compared.The results show that the surface morphology of the film is compact and smooth,and the cross section morphology is clear.The hardness and elastic modulus of the two Cu/Ni multilayer films show a trend of decreasing sharply at first and then becoming stable gradually.The hardness is stable at 6.5 GPa,and the elastic modulus is stable between 100 and 125 GPa.It is also indicated that pulse electrodeposition technology can realize the controllable preparation of Cu/Ni multilayer films with good adhesion and mechanical properties.