电沉积参数对铜镀层晶粒取向及性能的影响

Effect of electrodeposition parameters on grain orientation and properties of copper coatings

利用金相显微镜、扫描电镜、X射线衍射仪、显微硬度计、电导率测试仪对不同电流密度和硫脲浓度下电沉积制备的铜镀层表面和截面微观形貌、晶粒取向、硬度和电导率进行了系统的表征。结果表明:通过调节电流密度和硫脲浓度可实现晶粒择优取向为(100)、(110)和(111)铜镀层的可控制备。(100)铜镀层的最佳制备电流密度为1 A·dm^(-2),硫脲浓度为6 mg·L^(-1);(110)铜镀层的最佳制备电流密度为5 A·dm^(-2),硫脲浓度为9 mg·L^(-1);(111)铜镀层的最佳制备电流密度为1 A·dm^(-2),硫脲浓度为12 mg·L^(-1)。平整的表面形貌和致密的结构有助于提高铜镀层的硬度和电导率。

The surface and cross-sectional morphologies,grain orientation,hardness and electrical conductivity of copper coatings deposited at different current densities and thiourea concentrations were systematically investigated by metalloscope,scanning electron microscopy,X-ray diffractometer,microhardness tester and electrical conductivity tester.The results show that the controllable preparation of copper coatings with preferred grain orientations of(100),(110)and(111)can be achieved by adjusting the current density and the concentration of thiourea.The current density of 1 A·dm^(-2) and thiourea concentration of 6 mg·L^(-1) are in favor of the preparation of(100)copper coatings.The current density of 5 A·dm^(-2) and thiourea concentration of 9 mg·L^(-1) are conducive to the formation of(110)copper coatings.The(111)copper coatings are easy to be obtained under the current density of 1 A·dm^(-2) and thiourea concentration of 12 mg·L^(-1).The flat surface morphology and dense structure are beneficial to improve the hardness and electrical conductivity of the copper coatings.