酸性镀铜整平剂的应用现状及展望

Application status and prospect of acidic copper plating leveler

随着制造技术向微小化、复杂化、高精度化方向发展,电镀铜镀液中添加剂选择和使用变得更加重要。整平剂作为其中的关键组分,对于实现高平整性镀层、通孔盲孔填充等至关重要。本文简要综述了酸性硫酸盐镀铜整平剂的作用原理,并根据特征基团的不同,对目前研究开发的整平剂进行了分类与总结。最后介绍了整平剂目前的应用现状,并对添加剂未来研究方向和发展进行了展望。

With the development of manufacturing technology towards miniaturization,complexity,and high precision,the selection and use of additives in electroplating copper plating solutions become more important.As a key component,the leveler is very important for achieving high-level plating,through hole filling and blind hole filling,etc.This paper briefly reviews the action mechanism of acidic sulfate copper plating leveler.And according to the different characteristic groups,the leveling agents researched and developed at present are classified and summarized.Finally,the current application status of leveling agents is introduced,and the future research direction and development of additives are prospected.