摘要
背钻是通过二次机械钻孔的方式,将不利于信号传输的孔铜去除,背钻后残留的Stub长度越短,对信号传输的完整性越有利。文章主要研究了小孔背钻的过程能力优化以及高对准度背钻控制方法,实现背钻孔的堵孔改善及对准度提升。
Backdrilling is a process of removing stubs of drilled holes that may negatively affect signal transmission by performing secondary mechanical drilling.The shorter the residual stub length after backdrilling,the better the signal transmission integrity.This paper focuses on optimizing the process capability of small hole backdrilling and proposing a high-precision alignment control method to improve backdrilling hole plugging and alignment accuracy.
作者
许校彬
邵勇
陈金星
黄水权
Xiaobin Xu;Yong Shao;Jinxing Chen;Shuiquan Huang
出处
《印制电路资讯》
2023年第2期79-85,共7页
Printed Circuit Board Information
关键词
PCB
背钻
堵孔
对位能力分析
PCB
Backdrilling
Hole Plugging
Alignment Capability Analysis