摘要
基于面成型光固化3D打印技术的成型原理,系统探索了不同制件工艺参数耦合对钨粉粒子增强光敏树脂成型件表面硬度及尺寸收缩率的影响。首先通过单因素试验,选取曝光时间、分层厚度及液面等待时间3个因素作为响应面试验的水平值,然后采用Box-Behnken方法设计响应曲面试验,建立制件工艺与表面硬度和尺寸收缩率相互关系的预测模型,获得优化工艺参数,并进行试验验证。研究结果表明,分层厚度与曝光时间对制件表面硬度的交互作用显著,分层厚度与液面等待时间对制件尺寸收缩率具有显著的交互作用。钨粉复合光敏树脂制件的最优工艺参数为:曝光时间19.4 s,液面等待时间13.4 s,分层厚度0.06 mm,可得到制件收缩率为1.173%、表面硬度(HD)为87.8的轴承模型。
Based on the forming principle of surface forming photocuring three dimensional(3D)printing technology,the effects of process parameter coupling of different parts on the surface hardness and shrinkage of the tungsten particle reinforced photosensitive resin molding surface were studied.Firstly,taking exposure time,layer thickness and liquid level waiting time as the level values of response surface test by single factor test,the Box-Behnken method was used to design response surface experiments to establish a prediction model of the interrelationship between the manufacturing process and the surface hardness and deformation rate of the parts,and the optimized printing parameters were obtained and experimentally verified.The results show that the interaction between the layering thickness and exposure time on the surface hardness of the part is significant,and the interaction between the layering thickness and the light-off time on the shrinkage of the part is significant.The optimal process parameters for the tungsten powder composite photosensitive resin parts are exposure time of 19.4 s,liquid surface waiting time of 13.4 s,and delamination thickness of 0.06 mm,resulting in a bearing model with a deformation rate of 1.173%and a surface hardness(HD)of 87.8.
作者
宗学文
庞盈
刘亮晶
宋增全
鱼峰
ZONG Xuewen;PANG Ying;LIU Liangjing;SONG Zengquan;YU Feng(Institute of Additive Manufacturing Technology,College of Mechanical Engineering,Xi an University of Science and Technology,Xi an 710054,China;Guangdong Junjing Technology Co.,Ltd.,Foshan 528247,China)
出处
《塑料工业》
CAS
CSCD
北大核心
2023年第3期76-82,120,共8页
China Plastics Industry
基金
国家自然科学基金项目(51875452),叶轮增材制造产业化应用“科学家+工程师”队伍(2022KXJ-012)。
关键词
钨粉粒子
光敏树脂
硬度
收缩率
工艺参数优化
Tungsten Powder Particles
Photosensitive Resin
Hardness
Shrinkage
Optimization of Process Parameters