磨粒有序分布对金刚石锯片切割性能的影响

Influence of Abrasive Array Pattern on Cutting Performance of Diamond Saw Blades

本工作采用多层有序排布的方法制备金刚石磨粒有序分布的Fe基、Co基及Cu基结合剂金刚石锯片,并将其与传统磨粒随机分布的金刚石锯片切割性能进行对比。以切割时电流大小表征锯片的锋利性,以锯片外径磨损量表征锯片的寿命。结果表明,磨粒有序分布的锯片锋利度及寿命均优于传统方法制备的磨粒随机分布的锯片,且切割过程中磨粒有序分布的锯片稳定性更好。其中,Fe基有序分布的锯片切割过程中的最大电流为4.09 A,切割96 m陶瓷砖后的外径损失为0.45 mm,与Co粉制备的同类型锯片性能接近。

In this work,the method of multi-layer orderly array was used to prepare Fe-,Co-and Cu-based matrix diamond saw blades with orderly-distributed abrasive grains.The cutting performance of diamond saw blades with random and orderly-distributed abrasive grains was compared.Cutting current represented the sharpness of diamond saw blades,and loss of saw blade outer diameter represented the service life.The result showed that the diamond saw blades with orderly-distributed abrasive grains have better sharpness,service life and cutting stability.The maximum cutting current of Fe-based matrix diamond saw blade with orderly-distributed abrasive grains is 4.09 A,and the loss of the saw blade outer diameter of Fe-based is 0.45 mm after cutting 96 m ceramic tile,presenting similar performance to the same type of Co-based saw blade.