IC封装设备远距离芯片传输装置方案设计

Scheme Design of Long-distance Chip Transmission Device for IC Packaging Equipment

为了满足当前IC封装工艺过程中远距离芯片传输工艺的高速、高精度和高可靠性需求,并综合分析了现有芯片传输技术,提出了一种双旋转盘交替式直线轨道芯片传输方案,并对其进行了芯片传输实施方式描述和可行性分析,为国内IC封装设备企业芯片传输装置开发提供参考。

In order to meet the requirements of high-speed,high-precision and high reliability of the current long-distance chip transmission process,the existing chip transmission technology is analyzed and integrated,and a dual rotary disk alternating linear track chip transmission scheme is proposed.The chip transmission implementation mode is described and the feasibility analysis is carried out,which provides a reference for the chip transmission device development of domestic IC packaging equipment enterprises.