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高速全自动LED金线键合机解耦机构关键件结构优化

Topological Structure Optimization of Decoupling Mechanism Key Components of High Speed Full Automatic LED Gold Wire Bonding Machine
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摘要 高速LED金线键合机焊头在XYZ三维空间内高加速度工况下频繁往复、启停,要求其核心部分X/Y运动平台上解耦机构质量小,静动态特性良好。以某金线键合机的关键构件解耦板与交叉滑台为研究对象,将简化后构件模型利用有限元软件进行拓扑优化;对优化前后的解耦板与交叉滑台进行静力学、动力学分析,并对质量、静位移和1、2阶固有频率进行计算及对比,研究优化前后各对象的构件性能。结果表明:优化后的解耦板与交叉滑台最大静位移分别减小40.69%和35.29%,质量分别减少0.20051kg和0.09369 kg,轻量化效果显著;优化后解耦板1阶固有频率提高17.13%,交叉滑台的固有频率小幅下降。研究结果可为键合机运动平台结构进一步优化提供参考。 The welding head of the high speed LED wire bonding machine frequently reciprocates,starts and stops under high acceleration conditions in the XYZ three-dimensional space,requiring the decoupling mechanism on the X/Y motion platform as its core part to be lightweight and have good static and dynamic characteristics.Taking the decoupling plate and cross slide platform of the key components of a wire bonding machine as the research object,the simplified component model was optimized by using finite element software for topology optimization;the static and dynamic analysis of the decoupling plate and the cross slide platform before and after optimization was conducted,and the mass,static displacement,and first and second order natural frequencies were calculated and compared to study the performance of the component before and after optimization.The results show that the maximum static displacement of the decoupling plate and the cross slide platform after optimization and reconstruction are respectively reduced by 40.69%and 35.29%,and the mass is respectively reduced by 0.20051 kg and 0.09369 kg,the lightweight effect is significant;after optimization,the first order natural frequency of the decoupling plate has increased by 17.13%,and the natural frequency of the cross slide platform has decreased slightly.The results of this paper can provide a reference for further optimization of the motion platform structure of the bonding machine.
作者 周振财 叶国能 王柱 王天雷 周智恒 Zhou Zhencai;Ye Guoneng;Wang Zhu;Wang Tianlei;Zhou Zhiheng(Guangdong KEJIE Technology Co.,Ltd.,Jiangmen,Guangdong 529000,China;Faculty of Intelligent Manufacturing,Wuyi University,Jiangmen,Guangdong 529020,China;School of Eectronics and Information Engineering,South China University of Technology,Guangzhou 510640,China)
出处 《机电工程技术》 2023年第4期100-104,共5页 Mechanical & Electrical Engineering Technology
基金 广东省重大科技专项(编号:2011A080801011) 广东高校优秀青年创新人才培养计划(育苗工程)项目(编号:2014KQNCX157)。
关键词 高速LED 金线键合机 X/Y工作平台 拓扑结构优化 有限元分析 high speed LED gold wire bonding machine X/Y working platform topology optimization finite element analysis
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