室温快速固化环氧树脂固化剂的制备及性能研究

Preparation and Properties of a Curing Agent of Room Temperature Fast Curing Epoxy Resin

针对环氧树脂在室温下固化时间长、效率低的问题,文中采用硫脲、乙二胺、DMP-30制备了能使环氧树脂E-51涂层在室温下快速固化的环氧固化剂(TED),探究了原料比、反应温度、反应时间等反应条件对其固化效果的影响,对产物结构、胺值、黏度、固化时间和热稳定性进行表征。研究结果表明:当原料比n(硫脲)∶n(EDA):n(DMP-30)为1.2∶1.0∶1.2,反应温度为120℃,反应时间为42 min时,TED黏度为56 800 MPa·s,涂层可在45 min内快速固化,达到室温快固化效果;当温度达到80℃,TED固化剂开始分解,温度达300℃时,固化剂失重50%,其热稳定性能较好。

The study aims to solve the problems of long curing time and low efficiency of epoxy resin at room temperature.Thiourea,ethylenediamine and DMP 30 were used to prepare an epoxy curing agent(TED)which enabled the epoxy resin E 51 coating to cure rapidly at room temperature.The effects of the feeding ratio,reaction temperature and reaction time on curing were discussed.The products were characterized in terms of structure,amine value,viscosity,curing time and thermal stability.The results show that if the ratio of n(thiourea)[DK]∶n(EDA)[DK]∶n(DMP 30)was 1.2[DK]∶1.0[DK]∶1.2,the reaction temperature was 120℃,the reaction time was 42 mins,and the viscosity was 56800 MPa·s,the coating could be cured quickly within 45 mins,fast curing at room temperature.When the temperature reached 80℃,the TED curing agent started to decompose,and at 300℃,the curing agent lost 50%of its weight,with good thermal stability.