填孔电镀不良能力提升研究

The research of improving the ability to fill the hole

随着电子产品朝高速化、高频化、高密度方向的发展,印制电路板的盲孔填孔工艺越来越受到大家关注。目前,盲孔填孔电镀面临的最大问题是填孔深度不符,其中填孔深度不符的缺陷大部分是填孔漏填。造成填孔漏填的原因是填孔电镀的驱动力不足,导致起镀时间延后与爆发阶段受阻。填孔漏填会影响到产品的交付品质,而且一旦流入到客户端产品上将产生严重不良影响。控制填孔漏填的关键方法是在前处理、铜缸温度、电流分布,改善除油浓度、铜缸温度和电流分布环节中提升填孔电镀的深镀能力。

With the development of products in the direction of high speed,high frequency and high density,the blind hole flling process has attracted more and more attention.However,the biggest problem facing blind hole flling and plating at present is the inconsistent flling depth,and most of the defects of inconsistent flling depth are missing flling of holes.The reason for missing flling of holes is that the driving force of hole flling plating is insuficient.Lead to delay in starting plating time and block the outbreak stage.Hole flling and missing flling not only affect the delivery quality of the product,but also cause serious adverse effects once it flows into the client's products.We control the most critical factors affecting hole flling and missing flling,pre-treatment,copper cylinder temperature,and current distribution,to improve the removal Oil concentration,copper bath temperature and current distribution enhance the deep plaing ability of hole fling plating.