摘要
目前,具有轻、薄、可弯折等特点的挠性印制板应用领域越来越广。其中,在电源模块中,使用的一种双面开窗单面挠性印制板,看似结构简单,实则难点较多。首先介绍该种挠性印制板的结构和工艺流程,其次对镂空焊盘制作、铜面与覆盖膜结合强度、基板尺寸变化规律、覆盖膜对线路填充能力、字符结合强度等方面展开研究,最后得出可行的工艺方法。用此方法加工的挠性印制板通过了导通、高温存储、气密性测试等试验,证明能够满足电源模块电气互联的需求。
At present,flexible printed boards with the characteristics of light,thin and bendable are being used more and more widely.Among them,a kind of double-sided windowed single-sided flexible printed circuit board used in the power module seems to be simple in structure,but it has many difficulties.This paper first introduces the structure and process flow of this kind of flexible printed board,and then studies the fabrication of hollow solder pads,the bonding strength of copper surface and covering film,the change rule of substrate size,the flling capacity of covering film to the line,and character binding strength,and finally obtains a feasible process method.The flexible printed board processed by this method has passed the tests of conduction,high temperature storage,air tightness test,etc.,and can meet the requirements of electrical interconnection of power modules.
作者
高原
朱英帅
严柳
周光裕
GAO Yuan;ZHU Yingshuai;YAN Liu;ZHOU Guangyu(Xi'an Institute of Microelectronics Technology,Xian 710600,Shaanxi,China)
出处
《印制电路信息》
2023年第3期42-46,共5页
Printed Circuit Information
关键词
双面开窗
单面挠性板
制作工艺
电气互联
double-sided windowing
single-sided flexible board
fabrication process
electrical interconnection