医疗器械组装中用于返工的各向异性导电粘合剂研究

Research on anisotropic conductive adhesive for rework in medical device assembly

选择包含热固性环氧树脂和热塑性聚合物的粘合剂基质,它显示出确保良好电气和机械完整性的潜力,同时仍然允许可各向异性导电胶(ACA)互连的可再加工性。介绍了ACA应用相容的环氧树脂体系与具有良好机械强度和可再加工性的高性能热塑性聚合物之间的良好混合比的发现。研究了与生产/储存(23℃)、医用超声波探头(50℃)操作和ACA键(190℃)返工相关的不同温度下的模具剪切强度。确认完全清除粘合表面上残留的粘合剂,以便成功返工。结果表明,在温度23~50℃条件下,含有质量分数高达67%热塑性聚合物的粘合剂配方具有较高的模具剪切强度,与普通无铅焊料和传统ACA获得的剪切强度相当。在温度190℃时,模具剪切强度急剧下降,与返工评估结果非常吻合。

Adhesive matrices comprisedof a blend of thermosetting epoxy and thermoplastic polymer are selected becauseit has shown potential to ensure good electrical and mechanical integrity while still allowing reworkability for ACA interconnects.The findings of favourable mixing ratios between an epoxy system compatible with ACA applications and a high-performance thermoplastic polymer that offer good mechanical strength combined with reworkability were presented.Die shear strength at varying temperatures relevant for production/storage(23℃),operation of medical ultrasound probes(50℃)and rework of ACA bonds(190℃)wasstudied.Complete removal of adhesive remaining on bonding surfaceswas verifiedfor successful rework.The results show a high die shear strength at both 23℃and 50℃for adhesive formulations comprising up to 67%of thermoplastic polymer,comparable to the shear strength obtained for common lead-free solders and conventional ACA.The die shear strength at 190℃drops dramatically,and agrees very well with the results from the rework evaluation.