摘要
芯片能量密度不断提高,为保证其热安全性,对影响散热性能的液冷板采用有限元数值仿真方法,研究了不同结构和几何尺寸的液冷板对芯片温控特性和系统运行能耗的影响规律,研究结果获得了强化散热性能的冷板结构和几何尺寸选取方法。
Due to the continuous improvement of chip energy density,in order to ensure its thermal safety,the finite element numerical simulation method is used to study the influence of different structure and geometry sizes of liquid cold plates on chip temperature control characteristics and system operation energy consumption.The cold plate structure and geometric size selection method to strengthen the heat dissipation performance are obtained from the results of the study.
作者
高利军
许慧娟
张新
GAO Li-jun;XU Hui-juan;ZHANG Xin(Hebei Vocational University of Technology and Engineering,Xingtai,Hebei 054035,China;Hebei Key Laboratory of Human-Machine Environment Thermal Control Technology and Equipment,Xingtai,Hebei 054035,China)
出处
《邢台职业技术学院学报》
2023年第1期61-63,72,共4页
Journal of Xingtai Polytechnic College
基金
邢台市重点研发计划项目军民融合专项--“军民两用大功率密度电子器件散热模块的优化设计与性能研究”,项目编号:2021ZZ024。
关键词
芯片
液冷板
流道
强化散热
chip
liquid cooling plate
flow channel
enhanced heat dissipation
