摘要
基于焊点预测仿真软件Surface Evolver对不同焊盘设计的球栅阵列(BGA)封装焊点的回流形态进行预测。模拟不同回流焊的冷却速率与焊盘设计对焊点的残余应力和基板翘曲的影响。根据正交试验和灰色关联分析法对结果进行分析优化。结果表明,优化后的焊点芯片侧的残余应力降低了17.9%,PCB侧的残余应力降低了17.1%,其翘曲值为68.867μm。
Based on the solder joint prediction simulation software Surface Evolver,the reflow morphology of solder joints in ball grid array(BGA)packaging with different pad designs is predicted.The effects of different reflow cooling rates and pad designs on residual stress and substrate warpage of solder joints are simulated.The results are analyzed and optimized according to orthogonal test and gray correlation analysis.The results show that the residual stress on the chip side of the optimized solder joint is reduced by 17.9%,the residual stress on the PCB side is reduced by 17.1%with a warpage value of 68.867μm.
作者
王磊
金祖伟
吴士娟
聂要要
钱晶晶
曹纯红
WANG Lei;JIN Zuwei;WU Shijuan;NIE Yaoyao;QIAN Jingjing;CAO Chunhong(China Key System&Integrated Circuit Co.,Ltd.,Nanjing 210031,China)
出处
《电子与封装》
2023年第4期12-18,共7页
Electronics & Packaging
关键词
焊点预测
正交试验
灰色关联分析
残余应力
翘曲值
solder joint prediction
orthogonal test
gray correlation analysis
residual stress
warpage value
