多功率器件模块热耦合效应下热阻网络模型研究

Research on Thermal Resistance Network Model Under Thermal Coupling Effect of Multi-power Device Module

在使用IGBT等功率器件模块的电能变换装置中,通常需要利用热阻网络来预测功率器件的温度或者构建电能变换装置的电热仿真模型来进行动态电热联合仿真。多功率器件工作时,各个热源互相影响,需要考虑热耦合效应。基于线性叠加原理,建立了多功率器件模块热耦合效应下外热阻的热阻矩阵表示方法和外热阻网络模型,并采用有限元热模拟方法进行了仿真。根据仿真结果对热阻矩阵进行了计算。

In a power conversion device using power device modules such as IGBTs,it is usually necessary to use a thermal resistance network to predict the temperature of the power device or build an electrothermal simulation model of the power conversion device to perform dynamic electrothermal co-simulation.When multi-power devices work,each heat source affects each other,and the thermal coupling effect needs to be considered.Based on the principle of linear superposition,the thermal resistance matrix representation method and the external thermal resistance network model of the external thermal resistance under the thermal coupling effect of the multi-power device module are established,and the simulation is carried out by the finite element thermal simulation method.The thermal resistance matrix is calculated based on the simulation results.