一种航天用固态功率控制器封装工艺及其可靠性评价研究

The fabrication and reliability study of a kind of solid state power controller

采用厚膜混合电路技术制造一种用于航天领域的混合集成电路产品——固态功率控制器,对再流焊接、粘接等关键工艺进行技术攻关,实现了批量化生产。根据产品的应用要求,按照《混合集成电路通用规范》(GJB 2438B—2017)H级产品的规定进行了筛选试验,筛选试验包括温度冲击、高温功率老炼、恒定加速度、密封检验和颗粒碰撞噪声等,筛选合格率达到98%以上。另外,筛选后的合格产品抽样进行了1000小时的高温寿命试验和内部水汽含量测试,结果均满足《微电子器件试验方法和程序》(GJB 548B—2005)的要求。

In this paper a kind of solid state power controller was designed and fabricated using thick film hybrid circuit technology.The key fabrication processes such as components relow process and stick process were studied and finally the batch production was realized.Solid state power controller products went through the screening test according to General Specification for Hybrid Integrated Circuits(GJB 2438B—2017).The screening procedure includes thermal shock,high temperature power burn-in test,constant acceleration,hermetic sealing test and particle impact noise detection(PIND).Also,1000h life test was applied to samples after the screening test.The internal water vapor content was measured which is far below the requirement of Test Methods and Procedures for Microelectronic Device(GJB 548B—2005).