工业电子计算机断层扫描技术在印制电路板失效分析中的应用

Application of industrial electronic computed tomography in failure analysis of printed circuit board

在印制电路板(PCB)的品质检测和失效分析等过程中,大量高价值样品需优先对缺陷点进行精准的无损定位,确认缺陷现象和失效模式,经评估后才能确定是否需要开展破坏性分析。工业电子计算机断层扫描技术(CT)作为一种无损检测方法,可在不接触和不破坏PCB样品的前提下,以二维断层图像或三维立体图像的形式,清晰获取PCB内部结构、缺损状况等信息,无损地完成PCB开路、短路、爆板分层等缺陷分析及内层图形尺寸测量,对PCB的失效分析、质量控制和生产工艺提升具有指导意义。

In the process of quality testing and failure analysis of printed circuit board(PCB),a large number of high-value samples need to be prioritized for accurate non-destructive location of defect points,to confirm defect phenomena and failure modes,and to determine whether destructive analysis is necessary after evaluation.As a nondestructive testing method,industrial electronic computed tomography(CT)can obtain the information of PCB internal structure and defect condition clearly in the form of two-dimensional tomography image or three-dimensional image without touching or damaging PCB samples,and complete the defect analysis of PCB open circuit,short circuit,blasting board stratification and the measurement of inner layer graphic size without damaging.It has guiding significance for PCB failure analysis,quality control and production process improvement.