5G功放板填孔覆盖镀层耐热性能研究

Study on heat resistance of 5G power amplifier POFV

5G功放板覆盖镀层(POFV)的耐热性能直接影响印制线路板(PCB)组装之后的可靠性,因此在制作此类产品之前,重点对5G功放板填孔POFV的耐热性能的影响因子进行了研究。通过采用鱼骨图对影响因子进行梳理,找出关键的流程及影响因子,针对性对印制线路板制作的树脂填孔流程的树脂烤板参数、电镀通孔(PTH)流程除胶参数、在流程中的停留时间,以及填孔树脂本身的热膨胀(CTE)特性等影响因子进行对比实验,并对各测试结果进行总结分析。根据实验测试结果,确认了影响填孔覆盖镀层与树脂分离的主要因素是所选填孔树脂与基板CTE特性的匹配性,此外填孔后的树脂固化烤板参数、磨树脂后到电镀通孔的停留时间、电镀通孔过程中除胶条件等对POFV镀层与填孔树脂分离有少许影响。

The heat resistance of plate over filled via(POFV)coating on 5G power amplifier board is directly related to the working reliability of printed circuit board(PCB)after assembly,so it is necessary to make this.Before the similar products,we mainly studied the factors affecting the heat resistance of the hole-filled covering coating(POFV)of 5G amplifier board.In this paper,the fish-bone diagram is used to sort out the influencing factors,find out the key process and influencing factors,and make a comparative experiment on the influencing factors such as the parameters of resin baking board,the parameters of removing glue in the process of electroplating through holes(PTH),the residence time in the process,and the thermal expansion(CTE)characteristics of the filling resin itself,and summarize and analyze the test results.According to the experimental test results,it is confirmed that the main factors affecting the separation of the hole-filled coating from the resin are the matching of the thermal expansion coefficient(CTE)characteristics of the selected hole-filled resin and the coefficient of thermal expansion(CTE)characteristics of the substrate,in addition to the curing baking parameters of the resin after hole-filling,the residence time from resin grinding to electroplating through-hole,and the conditions for removing glue during electroplating through-hole.It has a little effect on the separation of POFV coating and filling resin.