热塑性预浸带铺放过程的温度历程分析

Analysis of Temperature History in Laying Process of Thermoplastic Prepreg

采用Ansys模拟与实验研究相结合的方法,进行了模型验证,研究了热塑性预浸带自动铺放过程中各层的温度历程。结果表明,各层粘合点的峰值温度均呈先增大后趋于稳定的趋势,由于铸铝底板与预浸带之间的热导率相差太大,温度历程中粘合点峰值温度存在差异。通过模型计算及调控每层铺放的热气温度,各层粘合点的峰值温度达到一致,证明了该方法的有效性。在保证粘合点峰值温度一致的条件下,通过对不同铺放速度进行模拟发现,铺放速度越大,需要调控的热气温度越小,当铺放速度足够大时,即使不对各层的热气温度进行调控,仍能达到消除峰值温度差异的目的。计算结果表明,该速度的临界值为21 mm/s。

Ansys simulation and experimental research were combined to verify the model and explore the temperature history of each layer during the automatic placement of the thermoplastic prepreg tape.The results showed that the peak temperature of the bonding point of each layer increased gradually at first and then tended to be constant.The large difference in thermal conductivity between the cast aluminum base plate and the prepreg tape caused the difference in the peak temperature of the bonding points in the temperature history.Through the calculation of the model,the hot air temperature of each layer was adjusted to achieve the same peak temperature of the bonding points of each layer.The experiments verified the effectiveness of this method.Under the condition of ensuring that the peak temperature of the bonding points were consistent,by simulating different laying speeds,the following conclusions were drawn:the higher the laying speed,the lower the hot air temperature that needed to be adjusted.When the laying speed was large enough,the hot air temperature of each layer was not regulated,and the purpose of eliminating the peak temperature difference could also be achieved.The calculation results showed that the critical value of this speed was 21 mm/s.