TiO_(2)对金刚石/铜复合材料导热性能的影响

Effect of TiO_(2)on thermal conductivity of diamond/copper composites

为研究金刚石/铜复合材料界面传热对其导热性能的影响,采用放电等离子烧结制备了添加0.4~1.0 mass%TiO_(2)的金刚石/铜复合材料,分析了其微观结构、物相组成和热导率,研究了TiO_(2)对金刚石/铜复合材料导热性能的影响。结果表明:TiO_(2)的添加使金刚石表面变得粗糙,且在金刚石和铜的界面处形成了TiC过渡层;TiC过渡层有效地改善了金刚石和铜的结合,从而减少了裂纹及孔洞的形成,提高了声子传热效率;添加0.8 mass%TiO_(2)的金刚石/铜复合材料的热导率为421 W·m^(-1)·K^(-1),达到理论热导率的73%,相比未添加TiO_(2)的金刚石/铜复合材料(186 W·m^(-1)·K^(-1))提高了1.26倍。

In order to study the effect of interfacial heat transfer of diamond/copper composites on its thermal conductivity,the diamond/copper composites with TiO_(2)content of 0.4-1.0 mass%were prepared by spark plasma sintering,its microstructure,phase composition and thermal conductivity were analyzed,and the effect of TiO_(2)on the thermal conductivity of the diamond/copper composites was studied.The results show that the surface of diamond becomes rough with the addition of TiO_(2),and a TiC transition layer is formed at the interface between diamond and copper.The TiC transition layer effectively improves the combination of diamond and copper,thus reducing the formation of cracks and holes at the interface,and improving the phonon heat transfer efficiency.The thermal conductivity of the diamond/copper composites with TiO_(2)content of 0.8 mass%is 421 W·m^(-1)·K^(-1),which reaches 73%of the theoretical thermal conductivity,and is 1.26 times higher than that of the diamond/copper composites without TiO_(2)(186 W·m^(-1)·K^(-1)).