摘要
A laser scanning method was developed to metalize the surface of alumina substrates with copper.The modeling of the heating and cooling rates of the samples during the laser scanning process indicates that the metallization process involves the rapid melting and solidification of Al_(2)O_(3) and Cu and the evaporation and deposition of part of the Cu.The surface of the metalized alumina substrate was composed of copper spheres(~60μm in diameter)embedded into the alumina substrate and a thin layer of CuAlO_(2).
基金
financially supported by the National Natural Science Foundation of China(No.51872033)
the fund of the State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals(Nos.SKL-SPM202016 and SKL-SPM-202019)。
