Morphologies and evolution of intermetallic compounds formed between Sn_(1.0)Ag_(0.7)Cu composite solder and Cu substrate

This study investigated the morphologies of the intermetallic compounds(IMC)formed during soldering reaction between Sn_(1.0)Ag_(0.7)Cu-1.0SnO_(2) composite solder and Cu substrate at various temperatures.The prismtype Cu_(6)Sn_(5) forms when the soldering temperature is 260or 2800C,while those grains transform from prism type to scallop type at the temperatures of 300 and 320℃.It can be found that the morphologies of Cu6Sn5 grains affect adsorption of Ag_(3)Sn nanoparticles during soldering reaction.The scallop-type grains with a higher growth rate need to adsorb large amounts of Ag_(3)Sn particles.In terms of mechanical behavior,the shear strength of solder joint is improved from 40 to 46 MPa at soldering temperature of 300℃.In addition,the thickness of IMC increases with the extension of aging time.During aging,the morphology of Cu6Sn5 grains remains scallop type,but the number of Ag_(3)Sn nanoparticles is reduced largely.The scallop-type Cu^(6)Sn_(5) can increase in size and flatten in morphology with the aging time increasing.