玻封二极管受壳体拆装影响的仿真研究

Simulation Research on the Influence of Disassembly and Assembly of Glass Sealed Diodes

针对玻封二极管偶发的断裂问题,研究了玻封二极管在壳体拆装因素影响下的有限元仿真计算方法,测量了壳体拆装时施加给该电子设备的等效力,建立了带玻封二极管的电子设备计算模型,进行了壳体拆装因素影响下二极管强度的有限元计算分析,分别对施力拆装工况、配合尺寸偏差工况、随机振动工况下的计算模型进行仿真分析,并在随机振动工况下试验验证了仿真计算结果,证明了玻封二极管的断裂与情况下的壳体拆装因素无关,证实该仿真计算方法可靠,对电子设备二极管的故障分析具有重要参考价值。

Aiming at the accidental fracture of the glass sealed diode,the finite element simulation calculation method of the glass sealed diode under the influence of the disassembly and assembly of the shell is studied.The equivalent force applied to the electronic equipment during the disassembly and assembly of the shell is measured.The calculation model of the electronic equipment with the glass sealed diode is established.The finite element calculation analysis of the diode strength under the influence of the disassembly and assembly of the shell is carried out.The simulation analysis of the calculation model under the force disassembly condition,matching size deviation condition and random vibration condition is conducted respectively;and the simulation results are verified by tests under the random vibration condition.It is proved that fracture of the glass sealed diode is independent of the shell disassembly and assembly factors under reasonable circumstances.The results show that the simulation calculation method is reliable and has important reference value for fault analysis of the electronic equipment diode.