宇航用键合金丝评价体系及其应用研究

Study on Evaluation System and Its Application of Bonding Gold Wire for Aerospace

键合金丝广泛应用于小型化星载装备多芯片组件中,而复杂的空间环境要求键合金丝具有良好的可键合性和应用可靠性。本文在深入分析星载多芯片组件应用需求和典型失效模式的基础上,构建了键合金丝应用评价体系,从材料基础性能、工艺适用性和应用可靠性三个方面对键合金丝的可用性进行了全面的评估。应用本文提出的评价体系,对某国产键合金丝进行了系统应用评价,各项测试表明国产键合金丝与拟替代的进口金丝基础性能指标、可键合性和键合可靠性均相当,且在高温下国产金丝键合强度退化慢于进口金丝,呈现了更优异的应用可靠性。

Bonding gold wires were widely used in miniaturized multichip modules of aerospace equipment.The complicate space environment required that the bonding gold wires had good bonding property and application reliability.Based on the in-depth analysis of the application requirements and typical failure modes of aerospace multichip modules,the application evaluation system of bonding alloy wires were constructed,and the usability of bonding gold wires from three aspects was comprehensively evaluated:basic material properties,process applicability and application reliability.Using the evaluation system proposed in this paper,a domestic bonding alloy wire was systematically evaluated.The data show that the basic performance indexes,bonding ability and bonding reliability of the domestic bonding gold wire are equivalent to those of the replacement imported gold wire to be replaced.In addition,the bonding strength of domestic gold wire degrades slower than that of imported gold wire at high temperature,presenting better application reliability.