电子封装用钢基体外壳除氢研究

Study of Hydrogen in Electronic Packaging Steel Shells

钢基体(如10#钢)外壳在混合集成电路中大量使用,该外壳生产时,会接触或产生大量氢气。研究表明,密封电子器件中的氢会导致砷化镓、氮化镓等半导体芯片失效,影响器件长期可靠性。本文研究了电子封装用钢基体外壳内部的氢含量,分析了当前典型制备工艺下氢含量的产生原因,对比了不同镀种外壳的氢含量差异,并讨论了产生差异的原因。针对烧结及镀覆工序展开除氢试验,对经过低温/高温激发的封盖密封外壳,进行了氢含量测试,并获得了氢含量规律。研究结果为外壳制备提供了建议,也为外壳后续使用提供了依据。

Steel shells are widely used in Hybrid Integrated Circuit.A large amount of hydrogen is also produced in the preparation of the shells.The hydrogen will cause invalidation of Gallium or Arsenide semiconductor chip,and have a long-term impact on reliability of devices.This paper studies the hydrogen in electronic packaging steel shells,analyzes the source of hydrogen in normal preparation technology,discusses the variation in different plating shells.After dehydrogenation in different plating process,the hydrogen content is tested using low and high baking method and appears some regularity.This paper provides a basis study for hydrogen content in electronic packaging steel shells,It also provides a basis for the subsequent use of the shells.