微电路器件热性能评价标准体系建设研究及建议

Research and Suggestion on the Construction of Thermal Performance Evaluation Standard System of Microcircuit Devices

热环境应力是舰载、机载、舱内和户外等场景中使用的大型电子系统的一种重要工作应力。电子系统朝密集化、系统集成化发展导致使用的电子元器件越来越多并密集布列,而且,元器件本身的高频、高速和超大规模集成发展,导致单个器件或模组的功耗急剧地增加、温升急剧地增大。为了保障系统稳定工作,必须准确地了解器件的热特性,构建准确的器件级子模型。长期以来,国内针对微电路器件热特性评价的标准体系不完整,导致产品设计、检测及应用各个方面均存在问题。针对微电路器件热特性评价的意义和作用展开讨论,对行业存在的主要问题进行了分析归纳,介绍了目前国内外热特性标准体系总体情况,最后针对后续的标准体系建设给出了相关建议。

Thermal environment stress is an important working stress of large-scale electronic systems used in shipboard,airborne,cabin and outdoor.Electronic systems are becoming more intensive and integrated,which leads to more and more electronic components being used and densely distributed.And the development of high-frequency,high-speed and ultra large-scale integration of components has led to a sharp increase in power consumption and temperature rise of a single device or module.In order to ensure the stable operation of the system,it is necessary to accurately understand the thermal characteristics of components and build an accurate component level sub model.For a long time,the domestic standard system for thermal characteristic evaluation of microcircuit devices is incomplete,which leads to problems in product design,testing and application.The significance and role of thermal characteristic evaluation of microcircuit devices are discussed,the main problems existing in the industry are analyzed and summarized,and the overall situation of the current domestic and foreign thermal characteristic standard system is introduced.Finally,relevant suggestions are given for the subsequent construction of the standard system.