电子仪表外壳注塑成型工艺研究及模具设计

Research on Injection Molding Process of Electronic Instrument Shell and Mold Design

电子仪表塑料制件通过注塑成型加工而成。在注塑成型过程中,成型质量受模具表面温度、熔体温度、保压压力以及冷却时间等工艺参数影响,同时冷却水路对其成型过程也有一定的影响。通过Moldflow进行模流分析,探究最佳冷却水路。以制件的翘曲变形量作为响应目标,获取较理想的成型工艺参数。结果表明:采用循环式制件翘曲变形量为0.4700 mm,低于直通式水路制件翘曲变形量。当模具表面温度为30℃,熔体温度为246℃,保压压力为121 MPa,冷却时间为20 s,制件翘曲变形量最小为0.2931 mm。针对制件进行模具设计,由于制件表面凹凸不平,与脱模方向不一致,导致脱模困难,因此采用侧抽芯结构进行脱模设计。

Electronic instrument plastic parts are processed by injection molding.In the process of injection molding,the molding quality is affected by the process parameters such as mold surface temperature,melt temperature,holding pressure and cooling time,and the cooling water path also has a certain influence on the molding process.The moldflow analysis was carried out by Moldflow to explore the best cooling water path.Taking the warpage deformation of the part as the response target,the ideal forming process parameters are obtained.The results show that the warpage deformation of the circulating parts is 0.4700 mm,which is lower than that of the straight waterway parts.When the mold surface temperature is 30℃,the melt temperature is 246℃,the holding pressure is 121 MPa,the cooling time is 20 s,the minimum warpage deformation of the part is 0.2931 mm.The mold design is carried out for the part.Because the surface of the part is uneven and inconsistent with the demoulding direction,it is difficult to demould.Therefore,the side core-pulling structure is used for demoulding design.