HMDS在光刻工艺中的作用及验证方法研究

Study on the Role of HMDS in Photolithography and Its Verification Method

阐述光刻工序中六甲基二硅氮甲烷(HDMS)工序在改善光刻胶和硅片的黏合性能方面的工作原理及效果。通过关键参数试验验证,及对接触角的测量,确定理想的HMDS工艺参数。对光刻工序中的倒胶缺陷案例进行分析,通过调整HMDS工作特效的环境因素及控制方法,在改善光刻产品质量上的作用,给出了集成电路产业半导体芯片生产中光刻工序中出现的倒胶案例分析。

This paper describes the working principle and effect of hexamethyldisilazazene(HDMS)process in the photoresist process in improving the adhesion performance of photoresist and silicon chips.The ideal process parameters of HMDS are determined through the verification of key parameters and the measurement of butt contact angle.This paper analyzes the cases of glue pouring defects in the photolithography process.