典型弹上产品环境适应性提升技术研究

Research on Improvement Technology of Environmental Adaptability for Typical Missile Borne Equipment

建立了导弹电子、机电类产品元器件引脚和焊点的机械失效模型,并以典型弹上产品为研究对象,通过开展发射飞行力学环境传递特性建模与仿真,辨识出该产品的环境适应性薄弱环节,针对薄弱环节提出6种设计改进方案,并对这6种方案的改进效果进行了仿真分析,最终确定了3种优选方案。为进一步地固化研究成果,形成了一套基于仿真的典型弹上产品环境适应性提升流程,对于导弹的环境适应性保证具有借鉴意义。

The mechanical failure model of pin and solder joint of missile borne electronic and electromechanical equipment is established.Taking typical missile borne equipment as the research object,the weak point of the equipment is identified via modeling and simulating the transfer characteristics of the launch flight dynamics environment.For overcoming the identified weak point,six improvement projects are proposed and the improvement performance is simulated.Via comparing the simulation results,three optimal projects are finally identified for improving the environmental adaptability of the equipment.Furthermore,a set of implementation processes,for improving the environmental adaptability of typical missile borne equipment according to simulation,is achieved through solidification achievements.All the conclusions drawn from this work will provide some help for the environmental adaptability assurance of missiles.