某大功率固态合成功放组件散热设计

A thermal design of high power solid-state combining power amplifier

某大功率固态合成功放组件采用了空间功率合成技术,且热流密度较大,对组件的热设计提出了更为严格的要求。首先对散热进行理论分析,在固态合成功放组件散热设计中加入L型均温板实现三维空间内热量的快速传递;然后运用Icepak软件对功放组件进行仿真计算,提出了一种满足使用要求的散热结构;最后通过产品实测验证了该热设计方案的可行性,为后续类似功放产品热设计提供了新的思路。

A high power solid state combined the power amplifier is designed by spatial combining with high heat flux density;It puts forward more stringent requirements for thermal design of the assembly.It analyzes the heat dissipation theoretically.In the heat dissipation design of solid assembly,the L-shaped uniform-temperature plate is added to strengthen the heat transfer in 3D space.Then Icepak is used to simulate the components and a heat dissipation structure is proposed to meet the thermal requirements,the physical test after installation verifies the feasibility of the thermal design scheme of the components.This design provides a new idea for thermal design of similar power amplifier products.