无卤高频碳氢覆铜板的设计及性能研究

Design and performance study of halogen-free highfrequency hydrocarbon copper clad plate

以不同分子量碳氢树脂按比例混合作为主体树脂,加入部分特种环氧树脂来提高板材的抗剥离性能,并选用不同粒径的无机填料按比例加入来降低膨胀系数(CTE),采用不同无卤阻燃剂按比例混合使用来提高阻燃效果,再加以引发剂、固化剂、溶剂等制得所需胶液,最终成功制备无卤高频碳氢覆铜板(CCL)。该覆铜板具有较高的剥离强度、高耐热、低Z轴CTE、低介电常数(Dk),以及良好的机械加工性等优点,在通信领域、车载毫米波雷达、物联网、汽车电子等领域的高多层高频线路板中具有广阔的应用前景。

In this paper,hydrocarbon resins with different molecular weights are mixed in proportion as the main resin,some special epoxy resins are added to improve the peeling resistance of the plate,different inorganic fillers are added in proportion to reduce the expansion coefficient,different halogen-free flame retardants are mixed in proportion to improve the flame retardant effect,and then initiators,curing agents,solvents,etc.are added to prepare the required glue,and finally the halogen-free high-frequency hydrocarbon copper clad plate is successfully prepared.The copper clad plate has the advantages of high peel strength,high heat resistance,low Z-axis thermal expansion coefficient,low dielectric constant and good machinability.It has broad application prospects in the field of communication,vehiclemounted millimeter wave radar,the Internet of Things,automotive electronics and other fields of high frequency multilayer circuit boards.