非对称结构20层埋阻印制板翘曲的改善

Study on warpage improvement of buried resistance PCB with asymmetric structure

板翘是印制电路板(PCB)行业内的常见问题,它会增加PCB生产加工难度,同时影响PCB上元器件的装配效果,影响成品率。在客户需求中,常会出现一些不对称结构设计的PCB产品,这类产品出现板翘问题的概率较大。以一款20层非对称结构埋阻板的板翘问题为例,通过优化加工流程、排板方式及压合方式等措施,来改善PCB的板翘问题,以满足产品质量要求和客户需求。

As a common problem in PCB industry,board warping will increase the difficulty of PCB production and processing,and affect the assembly of components on PCB,which is not accepted by customers.In customer demand,there are some asymmetric structure design PCB products,which have high probability of plate warping.This paper introduces the warping problem of a buried resistance board with 20 layers asymmetric structure.Through the optimization of technological process,optimization of plate arrangement,optimization of laminated mode and other measures,the factory improves the printed circuit board warping,ensures the requirements of product warping,and meets the customer needs.