填孔覆盖电镀拐角裂纹改善研究

Research on corner crack improvement in POFV

针对填孔覆盖电镀(POFV)产生的拐角裂纹问题,系统研究了塞孔树脂的热膨胀系数、包覆铜厚度、盖覆铜厚、电镀线延展性等对冷热循环后填孔覆盖电镀设计拐角可靠性的影响。借助金相显微镜对拐角裂纹失效影响因素进行失效分析,同时利用冷热循环测试设备测试循环次数。结果表明:增加包覆铜厚度对填孔覆盖电镀的拐角裂纹有明显的改善作用;选择延展性好的电镀线及低膨胀系数塞孔树脂对填孔覆盖电镀的拐角裂纹无明显改善效果。

Based on the corner crack problem caused by plating over filled via(POFV),the influence of thermal expansion coefficient of plug hole resin,coated copper thickness,Cap copper thickness and different ductility electroplating lines on corner reliability of filling hole cover electroplating design after hot and cold cycling were systematically studied in this paper.With the help of metallographic microscope,corner crack failure influencing factors were analyzed using both hot and cold cycle test equipment test cycles,which could be concluded that the increased thickness for copper fill holes covering electroplating corner crack has obviously improvement effect,while choosing good ductility electroplating line and the plug hole resin of low expansion coefficient for filling holes covering electroplating cor ner crack has no obvious improvement.