摘要
开展了颗粒增强粘接接头的双悬臂梁试验,标定了其颗粒增强粘接层的Ⅰ型断裂能。建立了颗粒增强粘接接头的三维代表性体积单元有限元模型,研究了粘接层厚度、颗粒粒径和颗粒体积分数3种粘接层结构参数对接头强度的影响规律,探讨了颗粒增强粘接接头的断裂失效机理。结果表明,在粘接剂中加入一定量的颗粒增强了粘接接头的力学性能,其峰值载荷随粘接层结构参数的增加呈现出先增大后减小的趋势,且在粘接层厚度为0.5 mm、颗粒粒径Φ60μm、颗粒体积分数4%时达到最大值;颗粒的存在改变了裂纹的扩展路径,提高了接头的失效断裂能,进而提高了接头的力学性能。
The double cantilever beam(DCB)test of particle-reinforced bonded joints was carried out,and the I-type fracture energy of the particle-reinforced bonded layer was calibrated.The three-dimensional representation volume element(RVE)finite element model of the parti-cle-reinforced bonded joints was established,and the influence laws of three kinds of bonding layer structural parameters of bonding layer thick-ness,particle size and particle volume fraction on the joints strength were studied,and the fracture failure mechanism of the particle-reinforced bonded joints was explored.The results show that the mechanical properties of the bonded joints are enhanced by the addition of a certain amount of particles to the adhesive,the peak load increases first and then decreases with the increase of structural parameters of bonding layer,and reaches the maximum value with bonding layer thickness of 0.5 mm,particle size ofΦ60μm and particle volume fraction of 4%;the pres-ence of particles changes the crack expansion path and improves the failure fracture energy of the joints,and then improves the mechanical prop-erties of the joints.
作者
杜垚
曾凯
邢保英
张洪申
秦怡歆
陈江波
DU Yao;ZENG Kai;XING Bao-ying;ZHANG Hong-shen;QIN Yi-xin;CHEN Jiang-bo(College of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,China)
出处
《塑性工程学报》
CAS
CSCD
北大核心
2023年第5期195-201,共7页
Journal of Plasticity Engineering
基金
国家自然科学基金资助项目(51565022
50245036)。
关键词
颗粒增强粘接接头
Ⅰ型断裂能
RVE
峰值载荷
失效断裂能
particle-reinforced bonded joints
I-type fracture energy
RVE
peak load
failure fracture energy