电子封装低温互连技术研究进展

Research progress of low temperature interconnection technology for electronic packaging

电子产品作为现代电子行业的产物,已逐渐成为社会发展的主导力量,在电子产品封装过程中,电子器件的封装温度过高会产生较大的热应力,进而降低其可靠性。随着电子器件趋于微型化、高功率化、高集成化,其服役温度越来越高,如何解决电子器件“低温封装、高温服役”这一问题已迫在眉睫。本文就低温电子封装材料及方法,从封装母材、连接材料及连接方法三个方面进行总结,指出只有从母材、焊材及焊接方法同时入手,才能达到最佳技术效果,提出在母材表面制备链长更长的、易去除的临时保护层,采用烧结纳米银、纳米铜或瞬时液相混合焊料,借助与焊缝非直接接触的超声搅拌等材料和方法有望克服低温封装的技术瓶颈,同时提出采用微米级混合焊料并辅以超声振动实现连接的新思想。

As the product of modern electronic industry,electronic products have gradually become the leading force of social development.In the process of electronic product packaging,too high packaging temperature of electronic devices will produce large thermal stress,which will reduce its reliability.With the trends of miniaturization,high power and high integration of electronic devices,their service temperature is higher and higher.How to solve the problem of“low temperature packaging and high temperature service”of electronic devices is imminent.This paper summarized the low-temperature electronic packaging materials and methods from three aspects:packaging base metal,connecting material and connecting method.It was pointed out that the best technical effect could be achieved only by starting with the base metal,soldering material and soldering method at the same time.It was proposed that preparing a temporary protective layer with longer chain length and easy to remove on the surface of the base metal,using sintered nano-silver,nano-copper or instantaneous liquid phase mixed solders,and soldering with the help of methods such as ultrasonic stirring which is not in direct contact with the solders,the technical bottleneck of low-temperature packaging could be overcomed.At the same time,a new idea of using micron mixed solders supplemented by ultrasonic vibration was put forward.