金锡合金熔封中的焊料内溢控制

Control of Solder Inner Overflowing in Gold-Tin Solder Sealing

金锡合金熔封是气密封装的主要封帽技术之一,焊料内溢是金锡合金熔封过程中的普遍现象。焊料内溢会缩小键合引线与盖板的间距,严重的甚至会引起短路,偶尔也会导致粒子碰撞噪声检测(PIND)试验不合格。讨论了焊料内溢产生的原因,并从密封设计、封帽夹具、盖板镀层等方面提出了内溢控制措施。

Gold-tin solder sealing is one of the main lid-sealing technologies for hermetic packaging.Solder inner overflowing is a common phenomenon in gold-tin solder sealing process.Solder inner overflowing will reduce the space between bonding wires and the cover lid,and even cause short circuit in serious cases.It can also cause particle impact noise detection(PIND)tests to fail occasionally.The causes of solder inner overflow are discussed,and the control measures for inner overflow are put forward from the aspects of packaging design,cap clamp,cover lid plating and so on.